3- D ICs

This  Electronics Engineering Seminar Topic deals with the following:

There is a saying in real estate; when land get expensive, multi-storied buildings are the alternative solution. We have a similar situation in the chip industry. For the past thirty years, chip designers have considered whether building integrated circuits multiple layers might create cheaper, more powerful chips.

Performance of deep-sub micrometer very large scale integrated (VLSI) circuits is being increasingly dominated by the interconnects due to increasing wire pitch and increasing die size. Additionally, heterogeneous integration of different technologies on one single chip is becoming increasingly desirable, for which planar (2-D) ICs may not be suitable.

The three dimensional (3-D) chip design strategy exploits the vertical dimension to alleviate the interconnect related problems and to facilitate heterogeneous integration of technologies to realize system on a chip (SoC) design.  By simply dividing a planar chip into separate blocks, each occupying a separate physical level interconnected by short and vertical interlayer interconnects (VILICs), significant improvement in performance and reduction in wire-limited chip area can be achieved.

In the 3-Ddesign architecture, an entire chip is divided into a number of blocks, and each block is placed on a separate layer of Si that are stacked on top of each other.

MOTIVATION FOR 3-D ICs
The unprecedented   growth of   the computer and the information technology industry is demanding Very Large Scale Integrated ( VLSI ) circuits with increasing functionality and performance at minimum cost and power dissipation. Continuous scaling of VLSI circuits is reducing gate delays but rapidly increasing interconnect delays. A significant fraction of the total power consumption can be due to the wiring network used for clock distribution,  which is usually realized using long global wires.

Furthermore, increasing drive for the integration of disparate signals (digital, analog, RF) and technologies (SOI, SiGe, GaAs, and so on) is introducing various SoC design concepts, for which existing planner (2-D) IC design may not be suitable.

INTERCONNECT LIMITED VLSI PERFORMANCE
In single Si layer (2-D) ICs, chip size is continuously increasing despite reductions in feature size made possible by advances in IC technology such as lithography and etching. This is due to the ever growing demand for functionality and high performance, which causes increased complexity of chip design, requiring more and more transistors to be closely packed and connected. Small feature sizes have dramatically improved device performance. The impact of this miniaturization on the performance of interconnect wire, however, has been less positive. Smaller wire cross sections, smaller wire pitch, and longer line to traverse larger chips have increase the resistance and capacitance of these lines, resulting in a significant increase in signal propagation (RC) delay. As interconnect scaling continues, RC delay is increasingly becoming the dominant factor determining the performance of advanced IC’s.

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